Introduction
Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.
Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.
Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software. Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.
Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Processor
Processor manufacturer
Intel
Processor model
E3-1230V3
Processor base frequency
3.3 GHz
Processor family
Intel® Xeon® E3 V3 Family
Processor cores
4
Processor socket
LGA 1150 (Socket H3)
Component for
Server/workstation
Processor lithography
22 nm
Processor series
Intel Xeon E3-1200 v3
Processor threads
8
System bus rate
5 GT/s
Processor operating modes
64-bit
Processor boost frequency
3.7 GHz
Processor cache
8 MB
Processor cache type
Smart Cache
Thermal Design Power (TDP)
80 W
Box
N
Cooler included
N
Stepping
C0
Bus type
QPI
Memory bandwidth supported by processor (max)
25.6 GB/s
Processor codename
Haswell
Processor code
SR153
Processor ARK ID
75054
Memory
Maximum internal memory supported by processor
32 GB
Memory types supported by processor
DDR3-SDRAM,DDR3L-SDRAM
Memory clock speeds supported by processor
1333,1600 MHz
Memory channels
Dual-channel
ECC
Y
Graphics
On-board graphics card
N
Features
Execute Disable Bit
Y
Idle States
Y
Thermal Monitoring Technologies
Y
Market segment
Server
Maximum number of PCI Express lanes
16
PCI Express slots version
3.0
PCI Express configurations
1x16,2x8,1x8+2x4
Supported instruction sets
SSE4.1,SSE4.2,AVX 2.0
Scalability
1S
CPU configuration (max)
1
Embedded options available
N
Graphics & IMC lithography
22 nm
Thermal solution specification
PCG 2013D
PCI Express CEM revision
3.0
Harmonized System (HS) code
8542310001
Export Control Classification Number (ECCN)
5A992C
Commodity Classification Automated Tracking System (CCATS)
G077159
Processor special features
Intel® Anti-Theft Technology (Intel® AT)
Y
Intel® Hyper Threading Technology (Intel® HT Technology)
Y
Intel® Identity Protection Technology (Intel® IPT)
Y
Intel® Turbo Boost Technology
2.0
Intel Fast Memory Access
Y
Intel Flex Memory Access
Y
Intel® Smart Cache
Y
Intel® AES New Instructions (Intel® AES-NI)
Y
Enhanced Intel SpeedStep Technology
Y
Intel Trusted Execution Technology
Y
Intel® Turbo Boost Technology 2.0 frequency
3.7 GHz
Intel® Transactional Synchronization Extensions
Y
Intel Enhanced Halt State
Y
Intel VT-x with Extended Page Tables (EPT)
Y
Intel® Secure Key
Y
Intel TSX-NI
Y
Intel Stable Image Platform Program (SIPP)
Y
Intel® OS Guard
Y
Intel 64
Y
Intel Identity Protection Technology version
1.00
Intel Secure Key Technology version
1.00
Intel Stable Image Platform Program (SIPP) version
1.00
Intel Virtualization Technology (VT-x)
Y
Intel Virtualization Technology for Directed I/O (VT-d)
Y
Intel TSX-NI version
1.00
Conflict-Free processor
N
Intel® vPro™ Platform Eligibility
Y
Technical details
Bus bandwidth
5
Bus type units
GT/s
Launch date
Q2'13
Processor cache
8192 KB
Product type
Processor
Status
Discontinued
Maximum memory
32 GB
Processor brand name
Intel Xeon
Supported memory types
DDR3-SDRAM,DDR3L-SDRAM
Last change
63903513
Product family
Intel Xeon Processor E3 v3 Family
Bus speed
5 GT/s
Packaging data
Package type
Retail box
Weight & dimensions
Processor package size
37.5 x 37.5 mm
Other features
Intel® Virtualization Technology (Intel® VT)
VT-d,VT-x
Compatibility
Intel R1304RPSSFBN, R1304RPOSHBN, R1208RPOSHOR, P4308RPLSHDR, R1208RPMSHOR, R1304RPMSHOR, S1200V3RPL, S1200V3RPS, S1200V3RPO, S1200V3RPM
Maximum internal memory
32 GB
Maximum internal memory
32768 MB
